About CircuiTech
Circuitech group is a full process, dynamic and flexible PCB manufacturer. PCB with the design of 8 layer and lower counts, 4mil + line/spacing, PTH size 10mil+ finish, general specification defined at the level of IPC-Class II. Our turn around lead time offered from 3, 4, 5 working days on FA run (First Article/sample), 8, 10 days production.
Product List
Product Guide
Item | Description | Capability |
|---|---|---|
Material & Construction | Layer count | 2~22 layers |
Max. board size. | 20″X22″ | |
Finished board thickness | 6~125 mil | |
Tg | 130~200℃l | |
Board thickness tolerance | ❮40 mil ± 4.00, ❯40 mil ± 10% | |
Lamination | Warp & twist | 0.70% |
Inner layer thickness | min 3 mil core + H/H | |
Board thickness tolerance | ±3 mil | |
Dielectric layer tolerance | ±310% | |
Layer to layer reg. tolerance | ±3 mil | |
Min. thickness of P.P | 1080 (3 mil) | |
First Drill | Min. drilled hole | 5.9 mil |
Hole location tolerance | ±2 mil | |
Tolerance for D1 | ±1 mil | |
Lamination | Warp & twist | 0.70% |
Inner layer thickness | min 3 mil core + H/H | |
Board thickness tolerance | ±3 mil | |
Dielectric layer tolerance | ±310% | |
Layer to layer reg. tolerance | ±3 mil | |
Min. thickness of P.P | 1080 (3 mil) | |
Registration | D0?inner layer | ±mil |
D1?datum | ±3 mil | |
D2?D1 | ±3 mi | |
S/M to pattern | ±3 mi | |
Layer to layer | ±3 mi | |
Conductors | I/L(Min.)width | 2.5 mil (1/2 oz) |
I/L(Min.)space | 2.5 mil (1/2 oz) | |
O/L(Min.)width(0.5oz for O/L) | 2.5 mil (1/2 oz) | |
O/L(Min.)space(0.5oz for O/L) | 2.5 mil (1/2 oz) | |
I/L W/S(❮5mil)deviation | ±10% | |
I/L W/S(?5mil)deviation | ±10% | |
O/L W/S(❮6mil)deviation | ±10% | |
O/L W/S(?6mil)deviation | ±10% | |
Inner Layer | 10 oz | |
Outer layer finish | 4 oz | |
Copper Plating | Aspect ratio | FHS ≦ 0.2mm‐‐❯1:8, FHS ≦ 0.2mm–❯1:10 |
Min. hole mechanical drill size | 5.9 mil | |
Solder Mask | Min. thickness over copper | 0.4 mil |
Min. thickness at shoulder | 0.2 mil | |
Min. SMD space for dam | 7 mil (green) | |
S/M dam (gloss green/blue) | 3 mil | |
S/M dam (matte) | 4 mil | |
S/M dam (black) | 4.5 mil | |
Max. plugged hole | 23.6 mil | |
Max. plugged hole | 23.6 mil | |
Second Drill | D2 tolerance | ±1 mil |
NPTH location tolerance | ±2 mil | |
Finished Hole Tolerance | PTH (HAL/LF HAL) | ±3 mil |
Second Drill | D2 tolerance | ±1 mil |
NPTH location tolerance | ±2 mil | |
Finished Hole Tolerance | PTH (HAL/LF HAL) | ±3 mil |
PTH (ENIG/OSP/Imm Ag/Imm Sn) | ±2 mil | |
Hole size reduction after H.A.L | 5 mil | |
Forming | Punch | ±4 mil |
CNC routing | ±4 mil | |
Beveling | Beveling angle | 20~45° |
Tolerance for outline of beveling | ±4 | |
V-cut | V?cut angle | 30°/60°/90° |
Max. board thickness for v?cut | 126 mil | |
V?cut residual | ±2 mil | |
V?cut location | ±4 mil | |
Fixtured Test | Voltage | 200V |
Isolation | 10M? | |
Continuity | 10? | |
Min. SMD pad pitch | 15.7 | |
Flying Probe Test | Voltage | 250V |
Isolation | 10M? | |
Continuity | 12.7? | |
Min. SMD pad pitch | 4 mil | |
Impedance Control | Relative tolerance | ±10% |
Via Fill (per IPC-4761) | Via plug (resin/copper) | Max. 24 mil |
Second Drill | D2 tolerance | ±1 mil |
NPTH location tolerance | ±2 mil | |
Finished Hole Tolerance | PTH (HAL/LF HAL) | ±3 mil |
PTH (ENIG/OSP/Imm Ag/Imm Sn) | ±2 mil | |
Hole size reduction after H.A.L | 5 mil | |
Forming | Punch | ±4 mil |
CNC routing | ±4 mil | |
Beveling | Beveling angle | 20~45° |
Tolerance for outline of beveling | ±4 | |
V-cut | V?cut angle | 30°/60°/90° |
Max. board thickness for v?cut | 126 mil | |
V?cut residual | ±2 mil | |
V?cut location | ±4 mil | |
Fixtured Test | Voltage | 200V |
Isolation | 10M? | |
Continuity | 10? | |
Min. SMD pad pitch | 15.7 | |
Flying Probe Test | Voltage | 250V |
Isolation | 10M? | |
Continuity | 12.7? | |
Min. SMD pad pitch | 4 mil | |
Impedance Control | Relative tolerance | ±10% |
Via Fill (per IPC-4761) | Via plug (resin/copper) | Max. 24 mil |
Beveling | 3 | 20~45° |
Tolerance for outline of beveling | ±4 | |
V-cut | V?cut angle | 30°/60°/90° |
Max. board thickness for v?cut | 126 mil | |
V?cut residual | ±2 mil | |
V?cut location | ±4 mil | |
Fixtured Test | Voltage | 200V |
Isolation | 10M? | |
Continuity | 10? | |
Min. SMD pad pitch | 15.7 | |
Flying Probe Test | Voltage | 250V |
Isolation | 10M? | |
Continuity | 12.7? | |
Min. SMD pad pitch | 4 mil | |
Impedance Control | Relative tolerance | ±10% |
Via Fill (per IPC-4761) | Via plug (resin/copper) | Max. 24 mil |
Item | Description | Capability |
|---|---|---|
Finish Board | Layer count | 1-4 layers |
Board thickness | 0.024″~0.093″ | |
Dimension (Max) | 18″ x 24″ | |
Material & Construction | FR-4 | (TG-135) |
PP-Laird (Heat transmit rate 3.0W/m.k) | 1KA04~1KA12 (4~12 mil) | |
PP-ARLON (Heat transmit rate 2.0W/m.k) | 92ML0488 (3.4 mil), 92ML0690 (4.4 mil) | |
5052 Aluminum board | 0.016″~0.080″ | |
White silk ink reflect rate ❯70% | Taiyo WT-500 | |
White silk ink reflect rate ❯90% | TeamCham T75W15A | |
White silk ink discoloration ? 3 excursions | Taiyo WT-02 | |
Inner Layer | Max. working panel size | 18″ x 24″. |
Board thickness | 6 mil~60 mil | |
Max. Cu thickness | 2 oz | |
Min. line width & pitch | 3.5 mil/3.5 mil (for H/H oz ) | |
Laminate | Finish board thickness general | Board thickness tolerance ±10% (thickness ❮ 39.4 mils, ± 4 mil) |
Max. operative size | 33″ x 44″ | |
PP thickness | LAIRD 1KA04~1KA12 (4~12 mil), ARLON0488 (3.4 mil) / 0690 (thickness 4.4nmil) | |
Aluminum board thickness | 5052 (0.016″~0.080″) | |
Planarization | Max. width | 29.5″ |
Thickness | 0.024″~0.118″ | |
Abrasive Belt | Max. width | 25″ |
Thickness | 0.016″~0.118″ | |
Drilling | Slot lengh : width | ≧2.5 mil；if ≦2.5 mil, NPTH long edge + 6 mil﹐PTH long edge + 8 mil |
PTH tolerance | ± 3 mil(min 2 mil) | |
NPTH tolerance | ±2 mil. | |
PCB drilling diameter | 0.010″~0.250″ | |
Aluminum board drill diameter | 0.020″~0.250″ | |
Plating | Min. hole diameter | 9.8 mil |
Min. board thickness | 8.4 mil (over Cu) | |
Min. Cu thickness | 0.7 mil | |
Aspect ratio | 6:01 | |
Outer Layer | Max. working panel size | 18″ x 24″ |
Board thickness | 10 mil (over Cu) ~125 mil | |
Max. etching Cu thickness | 2 oz | |
Min. line width & pitch | 4 mil/4 mil | |
Solder Mask | Thickness (over circuit) | ❯ 0.4 mil |
PITCH ?16 mil (black/white ink) | 5 mil min dam width | |
Slant | 3 mil | |
Silk Printing | S/M pad pitch | 3 mil |
Slant | 2 mil | |
Thickness | 0.4 ± 0.2 mil | |
Min. line width | 5 mil | |
Forming | V-CUT operative length | 2.0″-24.0″ |
V-CUT slant tolerance | ± 4 mil | |
Routing tolerance | ± 5 mil | |
Routing 1 PCS min. width | 0.315″ | |
Routing 1 PCS min. pitch | 0.080″ | |
Punch 1 PCS min. width | 0.110″ | |
Punch 1 PCS min. pitch | 0.059″ | |
HASL | Thickness | min 40 μ”, max 1000 μ” |
Min. operative size | 4.7″ x 4.7″ | |
Max. operative size | 15″ x 20.5″ | |
Immersion Gold | Plated Gold thickness | 2-3 u” |
Min. operative size | 12″ x 14″ | |
Max. operative size | 21″ x 24′ |
Item | Description | Capability |
|---|---|---|
Material (insulation layer) | RCC | YES |
FR4 prepreg | YES | |
Process | I/L trace and space (1.0 oz)) | 3mil/3mil |
I/L srace and Space (0.5 oz) | 2.5mil/2.5mil | |
O/L trace and space | 2.5mil/2.5mil | |
Drill through hole | 8 mil | |
Pad over drill size | 10 mil | |
Buried via hole size | 8 mil | |
Blind via hole size | 4 mil | |
AntiPad over blind via size | 10 mil | |
Pad over blind via size | 6 mil | |
Build up layers per side | 4 | |
Maximum aspect ratio of microvia | 0.7:1 | |
Stack via(1-2,2-3 blind via) | YES | |
Skip via(1-3 layer blind via, skip2) | NO | |
Via on PTH | YES | |
Via fil capability | YES |
Item | Description | Capability |
|---|---|---|
Heavy Copper | Max number of layers | 22 |
Max finished thickness | 125 mil | |
Solder masks & legend inks | YES (double coating) | |
Min solder mask clearance | 4 mil | |
Final finishes | ENIG / HAL/LF HAL / OSP/Imm Ag/Imm Sn | |
Blind & buried via capability | Min drill bit size | |
Min drill bit size | 10.8 mil | |
Max aspect ratio | 1:10 | |
Max external Cu weight (UL Approved) | 4oz | |
Max internal Cu weight (UL Approved) | 4oz | |
Controlled impedance | +/-10 % | |
Minimum silkscreen line width | 4 mil |
