The Shield Can and Clip range from Harwin is based on the concept of fast assembly and component protection. Designed for use within an existing SMT circuit board layout, these products are a simple and cost-effective method of shielding vulnerable or EMI-radiating board components.

By using a push-action, the removable shield can is held in place with SMTmounted spring clips, so no additional secondary soldering operation is required. All soldering takes place on the clip, at the same time as the rest of the PCB components. This eliminates the risk of heat damage and hot spots (caused by hand soldering) affecting the more expensive components located under the can.

The devices under the can are also now accessible at any time, by simply pulling out the can from the clips. Rework and module replacement can be completed, and the can is simply pushed back into place again.

Shield Cans are available in three different material thicknesses (0.3, 0.2 and 0.15mm) to assist matching to different EMI / RFI characteristics. Clips are supplied in a variety of shapes and sizes for added design flexibility.