AERO INDIA 2025,- February 10–14, 2025

We are delighted to invite you to join us at Aero India 2025 scheduled for February 10 – 14, 2025. This is an excellent opportunity to discover our latest products and engage with our team. We’re eager to learn about your business’s specific needs and explore how our extensive product offerings can benefit your operations.

Mark your calendars:

Date: February 10 -14, 2025
Venue: Air Force Station, Yelahanka, Bengaluru, Karnataka
Find Us: Hall J, Booth J4.3

To ensure we can provide you with the best experience, please RSVP using the link below. We look forward to meeting you at Aero India 2025!

Note: The above information is subject to any event updates or changes.

 

Airshow China – November 12–17, 2024

 

We are delighted to invite you to join us at Airshow China, scheduled for November 12 – 17, 2024. This is an excellent opportunity to discover our latest products and engage with our team. We’re eager to learn about your business’s specific needs and explore how our extensive product offerings can benefit your operations.

Mark your calendars:

Date: November 12 -17, 2024
Venue: Zhuhai International Airshow Center
Booth: H5S9

To ensure we can provide you with the best experience, please RSVP using the link below. We look forward to meeting you at Airshow China 2024!

Harwin 及 iConnexion 很高兴参加2024年的中国航展!欢迎您莅临我们的展位,我们的专业顾问将为您提供支持,期待了解贵公司的具体需求,并分享我们的最新技术和解决方案。

日期: 2024年11月12-17日
展览地点: 珠海国际航展中心
展位号: H5S9

请通过以下链接注册,以便我们更好地为您服务。期待在中国航展2024与您见面!

Note: The above information is subject to any event updates or changes.

Electronica South China – October 14–16, 2024

 

We are thrilled to invite you to join us at Electronica South China Exhibition, scheduled for October 14 – 16, 2024. This event presents an excellent opportunity to discover our latest products and engage with our expert team. We’re eager to learn about your business’s specific needs and explore how our extensive product offerings can benefit your operations.

Mark your calendars:

Date: October 14 -16, 2024
Venue: Shenzhen World Exhibition & Convention Center
Booth: 3C05

To ensure we can provide you with the best experience, please RSVP using the link below. We look forward to seeing you at Electronica South China!

Harwin 及 iConnexion 很高兴参加2024年的慕尼黑华南电子展!欢迎您莅临我们的展位,我们的专业顾问将为您提供支持,期待借此机会了解贵公司的具体需求,并分享我们的最新技术和解决方案。

日期: 2024年10月14-16日
展览地点: 深圳国际会展中心 (宝安馆)
展位号: 3C05

请通过以下链接注册,以便我们更好地为您服务。期待在慕尼黑华南电子展与您见面!

Note: The above information is subject to any event updates or changes.

Nepcon Vietnam – September 11–13, 2024

We warmly invite you to join us at NEPCON Vietnam 2024, happening between 11th to 13th September 2024. A golden opportunity to discover our latest product offerings and connect with our experienced consultants, we look forward to learning about the unique needs of your business and discuss how our wide range of products can be integrated into your operations.

Don’t miss this opportunity! Mark your calendars:

Date: September 11–13, 2024
Venue: Hanoi International Exhibition Center
Booth: Booth L07

To ensure we can accommodate your visit, kindly RSVP through the link provided below. We look forward to meeting you at Electronica India 2024!

Note: The above information is subject to any event updates or changes.

Electronica India – September 11–13, 2024

We are delighted to invite you to join us at Electronica India 2024, happening between 11th to 13th September 2024. This is a prime opportunity to discover our latest product offerings and connect with our experienced consultants. We look forward to learning about the unique needs of your business and discuss how our wide range of products can be integrated into your operations.

Don’t miss this opportunity! Mark your calendars:

Date: September 11–13, 2024
Venue: India Expo Mart (IEML), Greater Noida
Booth: Hall 11 Booth J21

To ensure we can accommodate your visit, kindly RSVP through the link provided below. We look forward to meeting you at Electronica India 2024!

Note: The above information is subject to any event updates or changes.

Electronica China- July 8–10, 2024

We are pleased to invite you to join us at Electronica China Exhibition, happening between 8th to 10th July 2024. This is a prime opportunity to discover our latest product offerings and connect with our experienced consultants. We look forward to learning about your business’ unique needs and discussing how our wide range of products can seamlessly integrate into your operations.

Don’t miss this opportunity! Mark your calendars:

Date: July 8–10, 2024
Venue: Shanghai New International Expo Centre
Booth: N4. 4759

To ensure we can accommodate your visit, kindly RSVP through the link provided below. We look forward to meeting you at Electronica China!

Harwin 及 iConnexion 很高兴参加2024年的慕尼黑上海电子展!欢迎您来到我们的展位,我们的顾问将于现场协助您,希望能借此机会认识贵公司的运作与需求以便与您分享我们的最新技术与创新。

日期:2024年7月8-10日
展览地点:上海新博览中心
展位号:N4. 4759

若您将参展,请在以下链接注册,以便我们更好地为您服务。期待与您见面!

Note: The above information is subject to any event updates or changes.

Future Mobility Asia- May 15 – 17, 2024

Powering the future of mobility! ⚡️ We’re revved up to be at the 𝐅𝐮𝐭𝐮𝐫𝐞 𝐌𝐨𝐛𝐢𝐥𝐢𝐭𝐲 𝐀𝐬𝐢𝐚 𝐅𝐚𝐢𝐫 in 𝐁𝐚𝐧𝐠𝐤𝐨𝐤! Visit us at 𝐐𝐮𝐞𝐞𝐧 𝐒𝐢𝐫𝐢𝐤𝐢𝐭 𝐍𝐚𝐭𝐢𝐨𝐧𝐚𝐥 𝐂𝐨𝐧𝐯𝐞𝐧𝐭𝐢𝐨𝐧 𝐂𝐞𝐧𝐭𝐞𝐫, Booth 𝐌𝐀𝟏𝟖 from 𝐌𝐚𝐲 𝟏𝟓𝐭𝐡 𝐭𝐨 𝟏𝟕𝐭𝐡 to see how we’re keeping Asia’s clean transportation moving. We are excited to demonstrate how our innovative components streamline production and boost efficiency at your business.

See you at Future Mobility Asia!

Date: May 15 – 17, 2024
Venue: Queen Sirikit National Convention Center
Booth: MA18

Flecto Floating Connectors

Flecto Floating Connectors

Features:
  • Movement in the X, Y, Z axes before and during mating to allow for multiple connections between two PCBs.
  • Up to 12GHz / 12Gbps data rate.
  • FLECTO signal-only connectors feature location pegs to eliminate movement during solder reflow. These are augmented with retention tabs to provide additional mechanical strength for surface mount connectors.
  • On the mixed signal and power connectors, through-board solderable posts are provided for both location accuracy and enhanced mechanical strength. The latter ensures resistance to shocks as high as 50G.
  • A number of the connectors in the family feature shrouded contacts to prevent accidental damage when no mating connector is present, while others offer polarization within the shroud to ensure mating is only possible in one direction.
  • Supports automated assembly with its Tape and Reel Packaging.
Applications:
  • Electric Vehicles
    • Infotainment Systems
    • Inverter Units
    • Battery Management Systems
    • LIDAR
  • Smart Factory
    • Factory Automation
    • Drives and Controls
    • Robotics
    • Sensor Units
    • Vision Systems
  • Embedded Systems
    • Datacoms
    • Home automation
    • Medical Devices
    • Transit Systems
Variations:

Consists of five series with three pitch options and floating mechanism is included in the male connector.

  • F10 series: 0.50mm (.0197″) pitch, all signal
  • F11 series: 0.5mm (.0197″) pitch, signal + power
  • F12 series: 0.5mm (.0197) pitch, all signal
  • F20 series = 0.635mm (.25″) pitch, all signal
  • F30 series = 0.80mm (.315″) pitch, all signal
Summary:

Interconnect is an integral and important aspect of every electronic design. Board-to-board connectors can allow designers to follow a modular design path, separating key elements of a system. This facilitates re-use across other designs, shortening time-to-market and reducing design risk. Additionally, these connectors support the development of compact, multi-board solutions that allow for small form-factor designs able to fit into space-constrained environments.

However, the increased demand for multiple connectors per board pair increases the possibility of potential misalignment during automated pick-and-place and solder reflow processes. This, in turn, can lead to manufacturing quality issues if the connectors experience unintended strain. In addition, once the systems are in the field, these stresses may be exacerbated by additional stresses resulting from short-term or long-term exposure to shock, vibration or changes in temperature. By accommodating and absorbing misalignments and small movements in multiple axes, floating board-to-board connectors such Harwin’s new FLECTO range allow OEMs to deploy automated manufacturing techniques for PCBs featuring multiple connectors without compromising data performance and power transfer capabilities.

 

Optronic Mast System

Optronic Mast System

Application:
Multi-spectral camera integrated into a submarine mast.

Background:
The customer has been using Harwin Connectors for many years, trusting the high-reliability connectors in the defense environment and their long-term availability.

The Challenge:
The new optronic system was an upgrade from a single HD camera to a 4k visible and short-wave infra-red camera with multiple sensors for all-light/all-weather conditions. The mast had to stay the same size, but the camera required more connections, so space was a major issue.

Harwin Solution:
Gecko-SL met the smaller size requirements, while still delivering the high-reliability performance expected for the environmental conditions.

 

Defence & Security UAV

Defence & Security UAV

Application:
Battery Power connection.

Background:
UAV platform with cameras and sensors for
surveillance and security applications: threat
detection, tracking ground assets, disaster
management, search and rescue, crowd
control. Operates up to 4,500 meters and
carries temperature and humidity
certification.

The Challenge:
Power required from the battery to a high
current payload application, needing
continuous 60A current through a
cable-to-board connection. Connection must
be high-reliability with solder cups on the
cable connector.

Harwin Solution:
The Kona 2-contact female cable connector
mated to the male PCB connector supplies
the high-reliability connection required, with
the 60A current-carrying capacity. The PCB
connector is on the battery side, making the
battery easy to disconnect and replace when
required.