Maintain Reliable PCB Contact in Space-Constrained Designs

Compact SMT contact solutions engineered for dependable electrical connections.

In compact electronic assemblies, maintaining reliable electrical contact is essential for stable system performance. Harwin Spring Contact Fingers are designed to provide dependable electrical contact through controlled mechanical compression between a PCB and its mating surface.

During assembly, the contact compresses against the mating surface, generating continuous contact pressure to help maintain reliable electrical continuity. This makes Spring Contact Fingers well suited for designs where space is limited, mechanical tolerances must be accommodated, or repeated contact is required.

 

Key Features: 

Harwin Spring Contact Fingers are available in SMT format for automated PCB assembly and are commonly used for grounding, RFI shielding, antenna contact, and general electrical contact applications. Depending on the selected part number, the range supports working heights from approximately 0.90mm to 6.95mm, current ratings up to 14A, and durability of up to 10,000 mating cycles. Finish options include gold and tin, with tape-and-reel packaging available for efficient automated assembly.

Key Highlights

✔ Compact SMT contact design

✔ Maintains reliable contact pressure during mating

✔ Suitable for wiping and sliding contact applications

✔ Compact footprint for space-constrained PCB layouts

✔ Available in gold or tin finish options

✔ Tape-and-reel packaging for automated assembly

✔ Supports grounding, shielding, antenna contact, and PCB-to-enclosure connections

Application and Market

Harwin Spring Contact Fingers are suitable for electronic applications that require reliable electrical contact within a compact PCB assembly.

Typical applications include:

• PCB grounding
• EMI/RFI shielding
• Antenna contact
• Board-to-board contact
• LED lighting assemblies
• RFID devices
• Vision systems

These contact solutions are commonly integrated into compact electronic products across industries such as automotive, industrial electronics, medical devices, wireless communications, and defense, depending on the application and system requirements.

Engineering Background:

In connected streetlight systems, engineers must integrate communication electronics into limited enclosure space. The unit must remain lightweight, self-contained, and easy to install on existing lighting infrastructure.

Traditional connection methods can increase space requirements, weight, or assembly complexity. For compact smart city electronics, the PCB connection method must support efficient production while maintaining a reliable interface between internal boards.

Harwin Solution

Harwin offers a comprehensive range of SMT Spring Contact Fingers in various heights, styles, contact forces, and finish options to support different PCB design requirements. The range is designed for automated assembly while providing dependable electrical contact in compact electronic systems.

Whether used for grounding, shielding, antenna contact, or PCB-to-enclosure connections, Harwin Spring Contact Fingers provide engineers with a compact and reliable SMT contact solution for modern electronic designs.

 

Download the Harwin Spring Contact Finger Technical Specifications

Access detailed product information, including dimensions, working heights, current ratings, finish options, packaging details, and selection guidance to help you choose the right Spring Contact Finger for your PCB design.

👉 Fill in the form below to download the Harwin Spring Contact Finger Technical Specifications.

Download Now

Need more information?
Contact Us | Request Sample

Summary

Harwin Spring Contact Fingers provide a compact SMT contact solution designed to maintain reliable electrical contact in modern electronic assemblies. Through controlled mechanical compression, they help support grounding, shielding, antenna contact, and PCB-to-enclosure connections where reliability, space efficiency, and consistent electrical performance are essential.

View Product

LS Materials Ultracapacitor Cells for High-Power Energy Support

Designed for fast charge/discharge, high power performance, and dependable energy support in demanding industrial and energy-related applications

LS Materials Ultracapacitor Cells are high-power energy storage components designed to support applications that require rapid energy delivery, frequent charge/discharge operation, and long-term reliability.

Unlike batteries, ultracapacitors store energy through a static charge mechanism, making them suitable for applications with high current demand over short durations. With their wide operating temperature range and maintenance-free characteristics, LS Materials Ultracapacitor Cells help support reliable performance across power backup, stabilization, industrial automation, and energy-related designs.

 

Key Features

✔ High Power Performance
Supports high power output for short-duration energy demand.

✔ Fast Charge/Discharge Capability
Designed for applications requiring rapid energy delivery and recovery.

✔ Low Internal Resistance
Helps support efficient power performance in demanding designs.

✔ Long Cycle Capability
Suitable for applications with repeated charge and discharge requirements.

✔ Maintenance-Free Design
Supports long-term use with reduced maintenance needs.

✔ Wide Operating Temperature Range
Designed to operate across demanding environments from -40°C to 65°C.

Why Ultracapacitor Cells Matter in Power Design

A simple look at how ultracapacitor cells support fast energy delivery, high power demand, and repeated cycling.

1. Respond Fast
   Supports rapid energy delivery for short-duration power demand.
2. Deliver High Power
   Suitable for applications that require high power within a short time.
3. Cycle Repeatedly
   Supports frequent charge and discharge operation.
4. Reduce Maintenance
   Maintenance-free design helps support long-term reliability.
5. Application & Market
   LS Materials Ultracapacitor Cells support applications that require high power, fast response, and
   reliable energy storage performance.

Applications & Target Markets

LS Materials Ultracapacitor Cells are suitable for energy storage applications that require frequent charge and discharge cycles, high current support, and short-duration power delivery.

According to the LSUC 002R8S 0120F EA datasheet, the ultracapacitor cell can be applied in:

• Wind power
• Hybrid systems
• Industrial automation
• Power backup
• Stabilization applications

These applications are commonly related to power electronics, renewable energy systems, industrial equipment, and backup power designs where fast energy response, repeated cycling, and dependable energy support are required.

 

Download the LSUC 002R8S 0120F EA Ultracapacitor Cell Datasheet

Access detailed specifications, electrical performance data, thermal information, mechanical dimensions, compliance details, and life information to better understand this LS Materials Ultracapacitor Cell for your power design requirements.

Complete the form below to access LS Materials Ultracapacitor Cell Datasheet and explore suitable options for your next project.

Download Datasheet Now

Need more information?
Request a Sample | Contact Sales

 

Summary

LS Materials Ultracapacitor Cells are designed to support fast energy delivery, high power performance, and repeated charge/discharge operation in demanding applications. With maintenance-free characteristics, wide operating temperature support, and long cycle capability, they provide a reliable component-level energy storage option for industrial, power backup, renewable energy, and mobility-related designs.

View Product

Powering Mission-Critical UAVs with Reliable 60A Connectivity

High-current cable-to-board power connectors engineered for defense, security and demanding UAV battery systems.

Modern UAV platforms are required to carry more than just cameras. In defense and security applications, they may support surveillance, threat detection, ground asset tracking, disaster management, search and rescue, and crowd control.

As payload systems become more advanced, battery power connection becomes a critical part of the UAV design. Cameras, sensors and high-current payload electronics depend on stable power delivery throughout the mission — from take-off to landing.

In this application, the UAV required a reliable battery-to-board power connection capable of supporting continuous 60A current to a high-current payload. Harwin Kona was selected to provide the high-reliability connection needed for this demanding UAV power system.

Key Features

• High-current cable-to-board power connection
• Supports 60A current-carrying capacity
• 2-contact female cable connector mated to male PCB connector
• Suitable for demanding UAV battery power systems
• Supports secure cable termination with solder cups
• Help enable easier battery to disconnect and replacement
• Designed for high-reliability applications where power continuity is critical

 

Application and Market

Harwin Kona is suitable for UAV platforms and mission-critical electronic systems where compact, reliableand high-current power connectivity is required:

Typical applications include:

• Defense and security UAVs
• Surveillance Drones
• Search and rescue UAV platforms
• Disaster response systems
• Ground asset tracking applications
• High-current sensor payloads
• Battery-powered aerospace electronics
• Rugged cable-to-board power systems

For UAVs operating in demanding environments, connector reliability directly supports mission uptime, payload stability and field serviceability.

 

Engineering Background

In a UAV power system, the battery-to-board connection must deliver current consistently while withstanding the demands of airborne operation. Movement, vibration, environmental changes and repeated battery handling can all place stress on the connector system.

The case study application involved a UAV platform operating up to 4,500 meters with temperature and humidity certification. The system required continuous 60A current from the battery to a high-current payload through a cable-to-board connection. The cable connector also required solder cups to support secure cable termination.

For engineers, this means the connector must do more than simply complete the circuit. It must provide a stable power path, reduce the risk of intermittent power loss and support reliable operation in a compact UAV design.

Harwin Solution

Harwin Kona provides the required high-current connection for this UAV battery power application.

The solution uses a Kona 2-contact female cable connector mated to a male PCB connector, delivering the high-reliability connection and 60A current-carrying capacity required by the payload system.

The PCB connector is positioned on the battery side, allowing the battery to be disconnected and replaced more easily when required. This supports practical serviceability, faster battery access and dependable power delivery during mission-critical operations.

Harwin Kona is designed for applications where high current, compact size and reliability are essential — making it a strong choice for demanding UAV, defense and security electronics.

 

Download Product Training Module — Harwin Kona

Access the Harwin Kona Product Training Module to learn more about its features, high-current performance, connector configuration and suitable applications.

Fill in the form below to download the Harwin Kona Product Training Module. Your download will be available immediately after submission.

Complete the short form to access full guide

Download Now

Need more information?
Contact Us | Request Sample

 

Summary

Defense and security UAVs depend on stable battery power to support cameras, sensors and high-current payload systems throughout the mission.

Harwin Kona provides a compact, high-reliability cable-to-board power connection with 60A current-carrying capacity, helping engineers design dependable UAV battery systems for demanding operating environments.

Reliable UAV power starts at the connection point.

View Product

Component Building Blocks for Connected Vehicle Communication ECUs

Explore component building blocks for EV telematics and V2X ECU design.

As electric vehicles become more connected, telematics and V2X communication systems play an important role in enabling vehicle-to-cloud data exchange, positioning, remote diagnostics, fleet monitoring and connected vehicle communication.

A telematics or V2X communication ECU is not built around one component alone. Beyond the wireless module, the system also requires reliable antenna connectivity, accurate timing, EMI/RFI control, power hold-up, thermal paths, PCB design support and protection circuitry.

This block diagram highlights selected component areas that support the development of EV telematics and connected vehicle communication hardware.

Applications & Target Markets

EV Telematics & V2X systems are commonly used to support:

• Vehicle-to-cloud data communication
• GNSS positioning and navigation support
• Remote diagnostics and fleet monitoring
• Emergency call and last-gasp data support
• Cellular, Wi-Fi and connected vehicle communication
• Communication ECU and telematics control unit design

These systems are typically found in telematics control units, connected vehicle platforms, fleet management systems and vehicle communication ECUs.

Engineering Background

A connected vehicle communication ECU often combines RF, digital, power and thermal design requirements in a compact electronic assembly.

Key design areas may include GNSS / LTE / Wi-Fi antenna connectivity, cellular or IoT wireless modules, stable timing references, board-level EMI/RFI shielding, RF and HDI PCB construction, short-duration backup power, thermal interface materials and surge-resistant protection components.

Each component area supports a different engineering requirement, such as signal integrity, RF noise isolation, clock stability, compact routing, power interruption support, heat transfer and circuit protection.

The Challenge

EV telematics and V2X hardware must operate reliably in a space-constrained and electrically noisy environment.

Design engineers may need to manage several challenges, including:

• Maintaining stable wireless and GNSS connectivity
• Reducing EMI/RFI noise around RF and communication circuitry
• Supporting accurate timing for GNSS, cellular and V2X platforms
• Providing short-duration power hold-up for emergency or shutdown events
• Managing heat from modem, RF IC and processor areas
• Designing RF / HDI PCB layouts with controlled impedance
• Protecting ECU power and sensing circuits from surge or pulse-load conditions

Selecting the right supporting components early in the design stage can help reduce layout risk, improvemsystem reliability and support smoother design validation.

iConnexion Solution

iConnexion supports engineers with application-relevant component recommendations for EV telematics and connected vehicle communication designs.

For this EV Telematics & V2X block diagram, we highlight component solutions across key design areas:

PCTEL – GNSS + LTE + Wi-Fi Combination Antenna

• Supports vehicle positioning and wireless connectivity for telematics data links
• Suitable for GNSS, LTE, Wi-Fi and connected vehicle communication systems
• Helps support reliable antenna connectivity in telematics and V2X hardware

Lierda – LTE / 5G / IoT Wireless Module

• Cellular module support for vehicle-to-cloud data transmission
• Suitable for remote monitoring, telematics connectivity and IoT communication
• Supports connected vehicle platforms that require wireless data exchange

Taitien – Standard VCTCXO / TCXO

• Provides stable clock source for GNSS, cellular and V2X connectivity
• Supports timing stability in communication and positioning systems
• Suitable for telematics ECUs that require reliable frequency reference

DACO – SiC MOSFET Discrete

• Supports auxiliary power switching in communication ECU circuit areas
• Suitable for power management and protection circuit support
• Helps address efficient switching requirements in compact electronic designs

Harwin – EMI/RFI Shielding

• Board-level shielding support for RF, GNSS and modem circuitry
• Helps reduce EMI/RFI noise around sensitive communication components
• Suitable for compact telematics ECUs where shielding and grounding are required

Sunshine PCB – RF / HDI PCB Platform

• Impedance-controlled multilayer PCB support for RF routing and dense layouts
• Supports high-speed communication ECU design
• Suitable for compact telematics and V2X hardware platforms

Fujipoly – SARCON Thermal Interface Material

• Thermal interface support for modem, RF IC and processor heat paths
• Helps transfer heat from active components to shield cans or enclosures
• Suitable for thermal management in compact communication ECU assemblies

Firstohm – Surge-Resistant MELF Resistor

• Protection and sensing support for ECU power circuits
• Supports input protection, voltage sensing and pulse-load circuit areas
• Suitable for telematics electronics exposed to demanding electrical conditions

Through our demand creation and technical support approach, iConnexion helps customers identify component options that are suitable for their application requirements, design stage and sourcing needs.

Download the iConnexion EV Component Solutions Catalogue

To explore the full EV application catalogue and discover recommended component solutions across EV architecture, smart vehicle electronics, battery management, power electronics, PDU, and Telematics & V2X applications, download our catalogue.

👉 Complete the short form to download the iConnexion EV Component Solutions Catalogue (PDF).

Download Brochure 

Need more information?
Request a Sample | Contact Sales

Summary

EV Telematics & V2X systems require more than wireless connectivity alone. A reliable communication ECU depends on multiple supporting component areas, including antenna systems, timing references, EMI/RFI shielding, backup power, PCB design, thermal interface materials and protection circuitry.

iConnexion provides component support to help engineers and design teams evaluate suitable solutions for connected vehicle communication hardware.

View Product

From Streetlight to Smart City Node

Discover how Harwin spring contacts support compact PCB connections for connected streetlight systems,public WiFi infrastructure, and smart city applications.

Modern streetlights are evolving beyond illumination. In smart city environments, streetlight units cansupport public WiFi, 4G/5G connectivity, and connected urban services while still fitting into compact,lightweight, and self-contained head units.

As more electronics are integrated into outdoor lighting infrastructure, engineers need connection solutions that help save space, reduce weight, and simplify PCB assembly. Harwin Spring Contacts provide a compact and effective method for creating reliable board-level connections in space-constrained smart city designs.

Key Features: 

✔ Compact SMT spring contact designs for space-constrained PCB assemblies
✔ Space-saving contact options for compact electronic modules
✔ Supports board-to-board, grounding, signal, and antenna contact applications
✔ Available in different spring contact styles and heights
✔ Tape-and-reel packaging options for automated assembly
✔ Lightweight contact solution for compact PCB designs
✔ Multi-directional options available for vertical and horizontal orientation requirements

Application and Market

Harwin spring contacts are suitable for smart city and connected infrastructure applications where compact, lightweight, and efficient PCB connection is required.

Common application areas include:

• Smart streetlight systems
• Public WiFi infrastructure
• 4G/5G-enabled urban equipment
• Outdoor electronic modules
• IoT infrastructure
• LED lighting systems
• Compact board-to-board assemblies
  
  

Engineering Background:

In connected streetlight systems, engineers must integrate communication electronics into limited enclosure space. The unit must remain lightweight, self-contained, and easy to install on existing lighting infrastructure.

Traditional connection methods can increase space requirements, weight, or assembly complexity. For compact smart city electronics, the PCB connection method must support efficient production while maintaining a reliable interface between internal boards.

Harwin Solution

Harwin Spring Contacts provide compact SMT contact solutions for PCB-level connection in space-constrained electronic designs. In the Streetlight with Public WiFi case study, a multi-directional spring contact was used in horizontal orientation to help save space and weight compared to pogo pin connections, while supporting fast board-to-board connection during production.

Beyond this application, Harwin’s Spring Contact range includes different contact styles and height options to support a variety of board-level connection needs, including board-to-board contact, grounding, signal contact points, and antenna contact applications.

 

Download the Harwin Spring Contacts Datasheet

Explore Harwin’s spring contact range, technical specifications, height options, and design information for compact PCB connection applications.

Fill in the form below to download the Spring Contact Datasheet. Your download will be available immediately after submission. 

Complete the short form to access full guide

Download Now

Need more information?
Contact Us | Request Sample

 

Summary

As streetlights become part of connected smart city infrastructure, internal electronics must be designed for compactness, reliability, and ease of assembly. Harwin spring contacts offer a space-saving PCB connection solution for public WiFi, 4G/5G connectivity, and connected lighting systems.

View Product

Clear, Responsive Display Solutions for Modern Electronics

Yeebo TFT Display Modules are designed to support clear colour interface, touch panel integration, and flexible design requirements across modern electronic applications.

 

Yeebo TFT Display Modules are developed for electronic products that require compact display integration, clear colour visuals, and reliable user interface performance.

As modern devices become more interactive and screen-driven, choosing the right display module is essential to ensure better readability, smoother user interaction, and efficient product design. From compact handheld devices to control panels and smart equipment, TFT display modules help deliver visual information clearly while supporting different design and application needs.

With available specifications, engineers and product designers can evaluate suitable TFT module options based on display size, resolution, interface, brightness, touch panel requirements, and mechanical design considerations.

Key Features

✅ Clear Colour Display Interface
Supports sharp and vibrant visuals for better information display and user experience.

✅ Wide Size Range
Available in compact to larger TFT display options to support different product design requirements.

✅ Touch Panel Integration
Supports capacitive touch panel customization for applications that require interactive user control.

✅ Flexible Design Options
Can support customization needs such as cover lens, PCB, metal shield, and mechanical fitting requirements.

✅ Compact Integration
Suitable for electronic products where space, display clarity, and usability are important.

✅ Application Versatility
Designed to support a wide range of display requirements across industrial, medical, smart home, handheld, and control applications.

Applications & Target Markets

Yeebo TFT Display Modules are suitable for a wide range of modern electronic applications, including:

• Industrial equipment
• Medical devices
• Smart home appliances
• Handheld devices
• Control panels
• Test & measurement equipment
• Instrumentation
• Consumer electronic products

Ideal for electronics design engineers, OEM & ODM manufacturers, industrial automation manufacturers, medical equipment manufacturers, smart device developers, and consumer electronics brands.

 

Get the Yeebo TFT Display Module Specifications

Access available specifications and technical information to better understand Yeebo TFT Display Modules and support your display design requirements.

Complete the form below to access Yeebo TFT Display Module specifications and explore suitable options for your next project.

Download Datasheet Now

Need more information?
Request a Sample | Contact Sales

 

Summary

Yeebo TFT Display Modules provide clear colour display performance, flexible integration options, and reliable visual interface support for modern electronic applications. With touch panel integration and customizable design possibilities, Yeebo TFT solutions are suitable for engineers and manufacturers developing industrial equipment, medical devices, smart home products, handheld devices, control panels, and instrumentation systems.

View Product

PCTEL Coach™ II 4G/5G FR1 GNSS Multiband Antenna for Reliable Mobile Connectivity

Compact, rugged, and engineered for connected systems that require reliable wireless performance, positioning support, and long-term durability.

The PCTEL Coach™ II 4G/5G FR1 GNSS Multiband Antenna is designed to support high-speed RF communication systems used across transportation, industrial, and smart infrastructure applications. With multiband coverage from 600 MHz to 6 GHz, support for 5G & 4G LTE, integrated WiFi MIMO, and proprietary high-rejection multi-GNSS technology, Coach™ II helps connected systems stay aware, connected, and reliable in demanding environments.

Whether you are designing for Intelligent Transportation Systems (ITS), Industrial IoT, tracking and asset management, EV charging stations, or material handling, this multiband antenna delivers the connectivity and durability your application demands.

 

Why GNSS + Wireless Connectivity Matter

Connected systems need more than basic connectivity. They rely on accurate positioning, continuous communication, and reliable operation in demanding environments. Coach™ II combines GNSS, 4G/5G, WiFi MIMO, and rugged antenna design to help connected systems stay aware, connected, and reliable.

 

Key Features

✅ Multiband Coverage from 600 MHz to 6 GHz – supports a wide range of cellular frequencies, including 5G and 4G LTE connectivity for modern connected deployments.

✅ GNSS Support for Positioning Applications – proprietary high-rejection filtering design allows wideband coverage for GNSS frequencies, helping support reliable positioning performance.

✅ WiFi MIMO Integration – incorporates WiFi MIMO and four dual-band WiFi elements to support connected communication systems.

✅ IP67-Compliant Rugged Design – built with a custom overmolded gasket to protect against water and dust ingress, making it suitable for challenging environments.

✅ Easy Installation and Replacement – features a metal stud mount with slotted jam nut and single cable exit for practical deployment.

Applications & Target Markets

The PCTEL Coach™ II is suitable for a wide range of mobile and connected applications, including:

• Intelligent Transportation Systems (ITS)
• Industrial IoT
• DSRC
• Tracking and asset management
• EV charging stations
• Material handling

 

Get the Full PCTEL Coach™ II Datasheet

Access detailed specifications, performance data, and installation information to support your antenna selection and connected system design.

👉 Complete the form below to download the PCTEL Coach™ II 4G/5G FR1 GNSS Multiband Antenna datasheet and explore the full product specifications.

Download Datasheet Now

Need more information?
Request a Sample | Contact Sales

 

Summary

Rugged, multiband, and designed for modern connected deployments, the PCTEL Coach™ II 4G/5G FR1 GNSS Multiband Antenna supports reliable wireless connectivity, GNSS positioning, and durable performance across transportation, industrial, EV charging, tracking, and material handling applications.

View Product

Powering AESA Radar Systems with High-Reliability Interconnects

Where performance, space, and reliability must coexist

In radar systems, failure isn’t gradual — it’s immediate. Active Electronically Scanned Array (AESA) radar relies on precise and continuous signal transmission to detect and track threats in real time. Within these systems, compact power modules must operate under tight space constraints, high current loads, and demanding environmental conditions. 

Every connection plays a critical role. A single point of instability can compromise overall system performance, making connector reliability a key consideration in both design and long-term deployment. Beyond performance, supply chain consistency has also become a growing concern — particularly for defense applications where timelines and lifecycle planning cannot be disrupted.

 

The Challenge 

The system was already functioning as designed — but supply became the risk. 

An existing connector had been designed into a compact radar power module. However, inconsistent availability and extended lead times began affecting production timelines and long-term planning. Replacing the connector posed a challenge, as any alternative needed to integrate seamlessly without requiring a complete redesign. 
 

The Solution — Datamate Mix-Tek 

Harwin’s Datamate Mix-Tek connectors provided a reliable alternative, combining high-current capability with a compact, high-reliability design. 

Key features include: 

• Up to 20A per contact for power-critical applications  

• 4.00mm pitch high-reliability connector system  

• Secure jackscrew fixing for enhanced vibration resistance  

• Gold-plated contacts for stable signal and power transfer  

• Compact horizontal PCB design for space-constrained modules  

These features make it particularly suitable for radar power systems where both electrical performance and mechanical stability are essential. 

 

Why It Performs Where Others Fail 

Datamate Mix-Tek is engineered for operation in demanding environments: 

• Wide operating temperature range from -55°C to +125°C  

• Proven resistance to shock, vibration, and mechanical stress  

• High-reliability contact system ensuring consistent connectivity  

• Designed for defence, aerospace, and mission-critical applications  

This level of performance ensures stable operation even under continuous load and harsh environmental exposure. 

 

Performance You Can Design Around 

By implementing Datamate Mix-Tek, the system achieved: 

• Stable high-current delivery under load  

• Reliable operation in harsh environments  

• Reduced connector footprint without compromising performance  

• Long-term durability for mission-critical deployment  

The result is a connector solution engineers can confidently design around — balancing performance, space, and reliability. 

 

Download the Datamate Mix-Tek Datasheet 

Access detailed product specifications, mechanical dimensions, and performance data to support your high-reliability designs. 

Fill in the form below to download the Datamate Mix-Tek Datasheet. Your download will be available immediately after submission. 

 

Complete the short form to access full guide

Download Now

Need more information?
Contact Us | Request Sample

 

Summary

In AESA radar systems, connector selection directly impacts system stability, performance, and long-term reliability. Harwin’s Datamate Mix-Tek offers a proven solution for engineers working within compact, high-demand environments — delivering the electrical performance, mechanical integrity, and supply confidence required for mission-critical applications.

View Product

Reliable Piezo Electric Elements for Clear & Consistent Acoustic Alerts

Compact, durable, and engineered for dependable sound performance across modern electronic applications.

The OBO Pro.2 Piezo Electric Elements are designed to deliver precise and reliable acoustic signaling for a wide range of electronic applications. Built with compact form factors and stable resonant performance, these piezo elements generate consistent alert sounds while maintaining durability under demanding operating conditions.

With multiple resonant frequency options available, designers can tailor sound output to match specific application requirements — from consumer electronics and automotive systems to security devices and IoT products. Their compact construction also makes them ideal for space-constrained designs without compromising audio performance.

 

Key Features

✅ Multiple Resonant Frequency Options
Available in various resonant frequencies to support customised sound output and application-specific acoustic requirements.

✅ Compact & Reliable Design
Small footprint enables easy integration into miniaturised electronic devices while maintaining dependable alert performance.

✅ AC-Driven Precision Performance
Designed for stable and consistent acoustic signal generation with efficient AC-driven operation.

✅ Durable & Long-Lasting Construction
Maintains reliable performance even under vibration, temperature fluctuations, and environmental stress.

✅ Versatile Integration Capability
Suitable for a broad range of electronic systems requiring audible alerts or notification functions.

 

Applications & Target Markets

Applications

• Home Electronics
• Automotive Systems
• Security & Alarm Devices
• Smart Home Products
• IoT Devices
• Industrial Control Equipment
• Consumer Electronic Products

Target Market

• Electronics Design Engineers
• Automotive Electronics Manufacturers
• IoT Device Developers
• Security System Integrators
• Consumer Electronics Brands
• Industrial Equipment Manufacturers

Get the Full OBO Pro.2 Piezo Electric Elements Datasheet

Access detailed specifications, resonant frequency options, and performance data to support your next electronic design.

👉 Complete the form below to access the OBO Pro.2 Piezo Electric Elements datasheet.
Get instant access to technical specifications and application insights for your next project.

Download Datasheet Now

Need more information?
Request a Sample | Contact Sales

 

Summary

The OBO Pro.2 Piezo Electric Elements provide dependable acoustic performance in a compact and durable design. With flexible resonant frequency options and broad application compatibility, they are an excellent solution for engineers seeking reliable sound alert components across consumer, automotive, industrial, and IoT applications.

View Product

Designing Compact Consumer Electronics? Meet the Spring Contact Solution Built for Tight Spaces

See how Harwin’s EZi Range helped a high-end hairdryer manufacturer redesign for compactness — without sacrificing reliability.

Public-facing consumer electronics demand sleek, compact designs without compromising on internal reliability. As devices shrink, PCB space becomes increasingly limited — yet the need for multiple stable contact points across internal systems remains. Harwin EZi Spring Contacts are engineered to deliver the right combination of footprint, contact height, and spring force, supplied in tape and reel packaging for seamless automated assembly.

Key Features: 

• Minimal footprint spring contacts for space-constrained PCB layouts
• Optimised contact height and spring force for consistent electrical performance 
• Supplied in tape and reel for compatibility with automated SMT placement 
• Suitable for multiple internal contact points within a single compact device 
• Reliable performance across high-volume consumer electronics applications 

 

Application and Market: 

Applications: 

• Hairdryers and personal care appliances 
• Wearable and handheld consumer devices 
• Smart home electronics and IoT devices 
  
  

Market: 

• High-end consumer electronics manufacturers 
• OEM product designers and engineers 
• Electronics contract manufacturers (EMS/CM) 

 

Engineering Background: 

High-end consumer electronics manufacturers are constantly redesigning existing product lines to meet market demand for more compact, premium devices. This directly reduces available PCB space while internal system requirements — including multiple contact points across different subsystems — remain unchanged. Connectors must maintain reliable electrical contact, support minimal footprint layouts, and be ready for automated assembly to meet production efficiency targets.

Harwin Solution: 

Harwin’s EZi Spring Contacts deliver: 

• Compact footprint that fits within tightened PCB space constraints 
• Precisely optimised contact height for reliable performance within compact housing 
• Calibrated spring force ensuring consistent contact across multiple internal points 
• Tape and reel packaging for seamless integration into automated assembly lines 

 

Download the EZi Range Datasheet

Access detailed product specifications, mechanical dimensions, and application guidance to support your design requirements. 

Fill in the form below to download the EZi Range Datasheet. Your download will be available immediately after submission. 

Complete the short form to access full guide

Download Now

Need more information?
Contact Us | Request Sample

 

Summary

Harwin Spring Contact demonstrated that compact design and reliable performance are not mutually exclusive. By delivering spring contacts with the ideal combination of footprint, contact height, spring force, and SMT-ready packaging, Harwin provided a solution that supported the customer’s ambition to push the boundaries of consumer electronics design.

View Product